• Datacon 2200 Evo Manual Sway Bar Disconnect Knob

ISI has qualified a variety of stacked bare die techniques. All of these processes are available for use with standard die and do not require custom die or TSVs (through-silicon vias).

IC Packaging. Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials. Die attach gold wire bonding; gold or aluminum wedge bonding.

Overmolding / contact stamping and forming. Encapsulation / glob-top or dam and fill. Flip chip including flux, high accuracy placement, reflow and underfill.

Combination of bare and packaged die enabled reduced form factors. High performance organic substrate vs. Ceramic provides a cost effective solution. Bare die assembly on flex/rigid circuits.

The Datacon 2200 evo s enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization. Microelectronics. 3D Non Contact Surface Metrology. Bond Testers.

Datacon 2200 Evo Manual Sway Bar Disconnect Knob

Die Bond and Sort. Dispensing. Hermetic Sealing Systems and Package Lidders.

Molding, Trim and Form, Singulation. Plasma Systems. Vacuum Soldering Systems. Wire Bonder. Test and Programming. Test Equipment. Device Programming.

1st Article Inspection. AOI Systems. Software Solutions. Metrology. Free jumpstart 2nd grade math.

3D Non Contact. Thermal Warpage and Strain Metrology. Applications. Service and Support. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

Equipped with integrated dispenser, 12' wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.ISI has qualified a variety of stacked bare die techniques. All of these processes are available for use with standard die and do not require custom die or TSVs (through-silicon vias). IC Packaging.

Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials. Die attach gold wire bonding; gold or aluminum wedge bonding.

Overmolding / contact stamping and forming. Encapsulation / glob-top or dam and fill. Flip chip including flux, high accuracy placement, reflow and underfill. Combination of bare and packaged die enabled reduced form factors. High performance organic substrate vs.

Ceramic provides a cost effective solution. Bare die assembly on flex/rigid circuits.